We're launching our new Elma TIPS blog series to share the integration insights we've gained from nearly four decades in rugged embedded computing. Our first post tackles a costly mistake we see too often: skipping VPX profile compatibility checks.
Sensor technologies are increasingly helping AI to advance. The blog discusses how advances are being made.
Designing power solutions for harsh and unpredictable environments requires creating systems that deliver ruggedness, flexibility and scalability. Overcoming the technical challenges entails innovative approaches in mechanical design, heat management, power source compatibility and regulatory compliance. By addressing these areas with precision, engineers can ensure that equipment remains reliable, even in the toughest conditions.
VITA 90, also known as VNX+, was developed to offer an alternative form factor to 3U OpenVPX for space, weight, and power (SWaP)-constrained applications. Incorporating nearly all of the technical features of 3U OpenVPX, it boasts a form factor roughly 30% less on a per-slot basis.
OpenVPX Offers a Forward Path for Space - SpaceVPX, or VITA 78, which was developed according to the Next Generation Space Interconnect Standard (NGSIS), leverages OpenVPX to create high performance, fault tolerant interoperable backplanes and modules for electronic systems of spacecraft. This relatively new update to the family of VPX standards is also being brought into the SOSA Consortium for inclusion in its reference architecture.
Over the past several years, the Modular Open RF Architecture (MORA) has evolved to address the challenges of increasingly complex radio frequency (RF) systems through an open standards-based infrastructure. With several industry partners working together to develop a collaborative framework, MORA’s interoperability and modularity has been realized, resulting in successful demonstrations of multiple manufacturers’ technologies working together. So, we asked some of our open standards partners: What’s next for MORA-based systems and the embedded computing community, now that interoperability demonstrations have been successfully deployed?