Examining the SOSA™ Power Envelope

December 15, 2020

Rounding our series of webinars explaining the various facets of the emerging SOSA™ open architecture standard, this session will focus on the evolution of the power envelope and requirements needed to build a mission platform.

Adopting and adding to the power standards defined in the VITA standards organization, SOSA makes the most of those definitions found in VITA 62 pluggable modules and cooling envelopes defined by VITA 47 and 48.x (liquid, conduction, air).

Our experts will review what is currently possible and what SOSA power definitions will provide. Join Elma Electronic and Behlman Power to learn about the electromechanical and power requirement differences between 3U and 6U form factors; the 12V centric configuration of SOSA power modules and the use of power keying; required power resources and cooling methods for the chassis platforms, as found in the VITA 48.x specifications; example of power usage and cooling methods that are being implemented in chassis platforms and views of what the capabilities they provide for the integrator; and use of SOSA system management using VITA 46.11 to optimize chassis/system power and thermal performance.

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The webinar, sponsored by Elma Electronic, discusses how platform power requirements drive designs for modular systems for air and ground vehicles. David Gash and Ken Grove are the speakers, focusing on the challenges posed by varying power levels and specific performance parameters for military platforms. They address the differences in power standards for aircraft and vehicles, including Milestone 1275 and 704 requirements, and the VITA 62.0 standard for power supply modules. The discussion also covers the trade-off between output power capacity and voltage resilience, as well as system considerations for power supplies, including starting current, power supply design, and chassis management for intelligent platform management.

https://elma-2.wistia.com/medias/1zyg6vlc2g

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Discover the critical shift in VPX systems' signal integrity at Gen4+ speeds and 100-Gigabit Ethernet, explored through the lens of VITA 68.3 standards development, real-world design cases, and high-performance cooling techniques in this insightful webcast.