As AI becomes more pervasive in computing solutions, it's only natural that it would become part of the conversation when discussing the implementations within the world of SOSA. This webinar examines how it is being designed into SOSA modules, with a specific focus on RF and AI solutions.
Elma's expert was joined by speakers from partners Concurrent Technologies and EIZO Rugged to discuss in-depth how different components of a modular open architecture system can deliver convincing AI solutions where do GPGPUs excel along with their software options; what advantages do CPU and FPGA designs have in AI, and what challenges can occur when integrating a system aligned to SOSA to meet the inevitable cooling challenges.
A deeper dive will discuss how the Expansion Plane is used for PCIe GPGPU solutions, how accelerators can be implemented on FPGA-enabled plug-in cards (PICs), examine the architecture topologies are needed to select the right backplane, and review the heat dissipation required in an integrated subsystem. Specific target applications are also addressed.
This is the first webinar in our deep-dive series into using the SOSA Technical Standard. We explore key aspects of blind mate optical and coax connector modules, channel mapping, and 3U VPX plug-in card cooling methods. Experts Mark Littlefield and Nino Addamo provide insights into VITA 66.5 and 67.3 connectivity and cooling strategies, offering practical guidance for optimizing your SOSA implementations.
Explore our on-demand webinar, “Implementing GPU-Powered Modular Open Systems Hardware for AI Acceleration in High-Demand Sensor-Based Applications.” In this engaging session, Elma Electronic partners with industry leader Chris Fadeley, CTO of EIZO Rugged Solutions, to discuss the transformative impact of NVIDIA®-powered GPGPU modular systems on AI acceleration for sensor-based applications.