GVSETS Paper Presentation: SOSA VNX+ is a Small Form Factor for Ground Vehicle-based Applications
This paper examines what the latest SOSA Technical Standard covers regarding VNX+, and how VNX+ based components can be used to develop sensor processing solutions for SWaP-constrained ground vehicle-based platforms.
Riding the Rails - Cabinet Design Considerations to Meet AREMA & CENELEC Rail Standards
Railway continues to be a highly viable form of mass transit and freight transport, with major infrastructure updates and high speed lines targeted for development over the coming years.
Optimizing Power Conversion in High-Reliability Rugged Embedded Systems
This white paper discusses supplying power for today’s highly mobile, highly rugged embedded computing environments, going well beyond just a simple power supply unit (PSU). While an integrated PSU is key to system operation, dense electronics are demanding more power than can reasonably be supplied from just one power source.
Packaging and functional considerations for mobile communication equipment
Mobile networking systems require solutions tailored to a range of challenging operating environments, and often with severe space limitations. These parameters can pose challenges in the design of the enclosure. This paper presents ways to address these challenges and discusses the mobile networking protocols required for seamless secure connectivity.
Chassis Management for OpenVPX and SOSA Systems
White paper discusses chassis management and monitoring chassis health in embedded systems deployed in military applications, using boards or plug-in cards designed to the OpenVPX standard or aligned to the SOSA standard.
11 Myths About Signal Integrity in OpenVPX Backplane Design
Common Misconceptions About Signal Integrity in High-Density Backplanes: the backplane manages much of the interconnect between various circuit boards or cards across a system. By cramming more electrical connections into the same footprint, high-density backplanes seem to invite signal integrity (SI) issues, making some embedded designers skeptical about how to best move this influx of data within their applications. Here, we explore what can be accomplished using a high-density backplane, while preserving signal integrity across the network.
OpenVPX cooling solutions
As processors and FPGAs enable more capability, the 3U VPX form factor is being favored for its reduced size and weight. The increasingly denser performance however,brings cooling challenges to implementing systems using a 3U card. This paper examines what types of cooling options are available and how they can be implemented.
Railway communication - fast and safe with CompactPCI Serial
Whether it’s in a lab, or an industrial setting, or even a mobile vehicle, instruments need to be increasingly smaller. In designing instrument cases, exact measurements are critical in maximizing density and performance. So how can this be achieved without high costs of tooling? How can costs be mitigated for prototypes or low volumes? This paper examines how.
Every millimeter counts: right-sizing for instrument cases
Whether in a lab, an industrial setting, or a mobile vehicle, instruments need to be increasingly smaller. In designing instrument cases, exact measurements are critical to maximize size, weight and performance. So how can this be done without high costs tooling, and how can costs be kept low for prototypes or low volumes?
Why CompactPCI Serial Suits Your Application
The CompactPCI Serial specification defines an affordable high speed serial, modular, and scalable approach to building systems for a wide range of applications, including transportation, aerospace, military, instrumentation, data acquisition, and communications. This paper describes the reasons and benefits of designing an embedded computing solution using this specification.